我國芯片光刻技術就快追貼全球霸主 ASML 了

[mtr]

China’s domestically developed EUV machine, utilizing laser-induced discharge plasma (LDP) technology—distinct from the LPP approach employed by ASML—is currently undergoing testing at Huawei’s Dongguan facility. Trial production is slated for Q3 2025, mass production for 2026.

https://x.com/NiSiv4/status/1898130668015485114

[mtr]

China is out competing ASML.

The laser-induced discharge plasma (LDP) EUV generation commercialization push is a DeepSeek moment for lithography that I was fearful of.

LDP is much more efficient than laser produced plasma (LPP) which ASML uses. LDP vaporizes a small quantity of tin into a cloud between two electrodes and then use high voltage to convert the tin vapor to plasma. The electrons collide with tin ions to produce the 13.5 nm EUV light. LPP requires high-energy laser and complex FPGA real time control electronics.

The LDP approach is simpler, smaller, more cost-effective and better energy efficiency.

Attached is comparison of LDP generation approach versus LPP.

https://x.com/I_loves_deep_nn/status/18 ... 3121452314

[圖唔貼了，反正大家多數睇唔明]

[joe]

[imcoke]

班鬼淨係識得禁
咪搞到中國自已搞
國定好波

[mtr]

堅？Mon 住 ASML 股價：
http://www.aastocks.com/tc/usq/quote/ch ... ymbol=ASML


https://x.com/Vito_168/status/1901479402351046673

劲爆：据可靠消息中国3纳米EUV光刻机即将在3季度开始试生产，2026年开始量产。

该3纳米EUV光刻机由中国华为整合国内相关单元技术研制，设备位于华为松山湖基地。

中国的光刻机技术路线采用的是LDP高压放电锡蒸汽发光技术，该技术为全新技术路线，目前已经申请专利。

与荷兰ASML（阿斯麦，又译艾司摩尔）已经使用了近20年的LPP激光打锡方案不同

中国方案体积更小，能耗更低，效率更高。

与其说是追赶，不如说是直接超越。

[joe]

[streamboy]

如果真係搞好, 鬼佬